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The International Electronics Manufacturing Initiative (INEMI) has published updated PCB Laminate, Board Assembly, and Complex Integrated Systems Roadmaps, outlining key technology requirements and gaps through 2030. The updates prioritize AI computing, 5G/6G communications, autonomous vehicles, and aerospace applications. Key highlights include: A new laminate section detailing ultra-low-loss material specifications for 1.6T+ high-speed interfaces. Enhanced board [...]

The International Electronics Manufacturing Initiative (INEMI) has published updated PCB Laminate, Board Assembly, and Complex Integrated Systems Roadmaps, outlining key technology requirements and gaps through 2030. The updates prioritize AI computing, 5G/6G communications, autonomous vehicles, and aerospace applications. Key highlights include: A new laminate section detailing ultra-low-loss material specifications for 1.6T+ high-speed interfaces. Enhanced board [...]

The Printed Circuit Board Association of America (PCBAA) announced the introduction of a new U.S. Senate bill aimed at reshoring and revitalizing the domestic PCB industry, which has seen its global market share decline from 30% to 4% over the past 30 years due to offshoring. The legislation proposes tax incentives, grants, and tariff relief [...]

OKI Group has successfully developed 180-layer, 15 mm-thick PCB technology for high-bandwidth memory (HBM) wafer testing equipment used in AI semiconductors. This represents a 45% increase in layer count and doubled thickness compared to the company’s previous 124-layer, 7.6 mm design. The new PCB addresses the growing demand for higher density and more I/O channels [...]

In March 2026, NVIDIA initiated supplier qualification testing for M10, a next-generation copper-clad laminate (CCL) material designed for its Rubin Ultra and Feynman AI platforms—marking a pivotal shift toward ultra-high-speed, low-loss PCB technology. Compared to the current M9 material, M10 reduces signal loss by 30%–40% versus traditional FR-4, enabling stable transmission at speeds beyond 1.6 [...]

The global printed circuit board (PCB) market is entering a structural boom in 2026, fueled by exponential demand for AI computing power. According to industry analysts, the market size reached approximately $84.9 billion in 2025** (up 15% year-over-year) and is projected to grow **12%–15%** in 2026, surpassing **$94 billion and approaching the $100 billion milestone. [...]

The electronic design automation (EDA) industry has ushered in a comprehensive intelligent upgrade, and AI-augmented EDA tools have begun to be widely applied in PCB design scenarios, completely changing the traditional manual-led circuit design mode. In the face of the increasingly complex ultra-high-density PCB wiring and multi-layer stack design requirements of consumer electronics and AI [...]

Global electronic material industry associations have officially released updated technical standards for high-frequency and high-speed PCB substrates, targeting the large-scale mass production of next-generation AI server architectures. The new standards focus on low dielectric constant (low Dk) and low dielectric loss (low Df) substrate performance indicators, optimizing parameter specifications for high-speed signal transmission in ultra-large [...]

The glThe global printed circuit board (PCB) market is set to reach $94–98 billion in 2026, growing at 12–15% year-over-year, fueled by explosive demand for AI infrastructure, data centers, and advanced electronics, according to industry analysts. AI servers are the primary growth engine: a single AI server requires 3–5 times more PCB volume and 8–12 [...]

April 9, 2026 — A significant technological milestone has been reached in the development of high-layer count printed circuit board backplanes, with successful research and validation of 70-layer+ midplane and orthogonal backplane PCBs for next-generation AI supercomputers. Independent technical testing institutions confirmed that the newly developed PCB backplanes achieve an exceptional layer-to-layer alignment precision of [...]