The International Electronics Manufacturing Initiative (INEMI) has published updated PCB Laminate, Board Assembly, and Complex Integrated Systems Roadmaps, outlining key technology requirements and gaps through 2030. The updates prioritize AI computing, 5G/6G communications, autonomous vehicles, and aerospace applications.
Key highlights include:
  • A new laminate section detailing ultra-low-loss material specifications for 1.6T+ high-speed interfaces.
  • Enhanced board assembly guidelines for 01005 ultra-small components and high-current CPU sockets.
  • A complex systems roadmap addressing thermal management, signal integrity, and reliability challenges in densely integrated AI and 6G hardware.
INEMI Director of Roadmapping Francis Mullany emphasized that miniaturization, faster switching speeds, and harsher operating environments are driving the need for continuous innovation in PCB materials, design, and manufacturing processes. The roadmaps serve as a collaborative framework for the global electronics industry to align R&D investments and standards development.