Item Capability Item Capability
Layers 1-28 Thicker Copper 1-6oz
Products Type HF(High-Frequency)&(Radio Frequency)board, Imedance controlled board,HDIboard, BGA& Fine pitch board solder mask Nanya&Taiyo, LPI&Matt red, green,yellow,white,blue,black.
Base Material FR4(Shengyi China, ITEQ, KB A+,HZ),HI-TG,Fr06,Rogers,Taconic,Argon,Naclo,Isola and so on Finished Surface Conventional HASL, Lead-Free HASL,Flash Gold,ENIG(Immersion Gold),OSP(Entek),Immersion Tin, Immersion Sliver, Hard Gold
Selective Surface Treatment EING(Immersion Gold)+OSP, ENIG(Immersion Gold)+Gold Finger, Flash Gold Finger, Immersion Sliver+Gold Finger, Immersion Tin+Gold Finger
Technical Specification Minimum line width/gap 3.5/4mil(laser dirll)
Minimum Hole Size 0.15mm(mechanical dirll) 4mil(laser dirll)
Minimum Annular Ring 4mil
Max Copper Thickness 6oz
Max Production Size 600mm*800mm
Board Thickness D/S:0.2-7.0mm, Multilayer:0.40-7.0mm
Min Solder Mask Bridge ≥0.08mm
Aspect Ratio 15:1
Plugging Vias Capability 0.2-0.8mm
Tolerance Plated holes Tolerance ±0.08mm(min±0.05)
Non-Plated Hole Tolerance ±0.05mm(min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance ±0.15mm(min±0.10mm)
Functional Test
Insulating Resistance 50ohms(normality)
Peel Off Strength 1.4N/mm
Thermal Stress Test 265℃,20seconds
Solder Mask Hardness 6H
E-test Voltage 500V+15/-0V  30s
Warp and Twist 0.7%(Semiconductor test board 0.3%)