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April 9, 2026 — A significant technological milestone has been reached in the development of high-layer count printed circuit board backplanes, with successful research and validation of 70-layer+ midplane and orthogonal backplane PCBs for next-generation AI supercomputers. Independent technical testing institutions confirmed that the newly developed PCB backplanes achieve an exceptional layer-to-layer alignment precision of [...]

April 7, 2026 — The global printed circuit board industry is ramping up efforts to advance sustainable and environmentally responsible manufacturing practices, with a unified industry target to increase the adoption rate of halogen-free circuit board materials from 65% in 2025 to 85% by 2027. This initiative aligns with stringent global environmental regulations, including the [...]

April 8, 2026 — A recent analysis of the global electronics manufacturing supply chain reveals a notable geographic shift in printed circuit board production, with Southeast Asia’s cumulative PCB manufacturing capacity projected to reach 25% of the global total by the end of 2026. This structural shift is driven by evolving international trade dynamics, optimized [...]

April 11, 2026 — The global high-performance computing (HPC) industry has officially designated M9-grade high-speed materials as the universal industry standard for next-generation AI server printed circuit boards in 2026, marking a pivotal technological transition in the PCB materials sector. Independent material performance testing has verified that M9-grade laminates deliver ultra-low signal loss with a [...]

April 13, 2026 — A comprehensive industry research report released this week by an independent global technology market analytics institution has projected that the global printed circuit board (PCB) market will surpass $940 billion in valuation by 2026, registering a compound annual growth rate of 12% to 15% over the forecast period. The unprecedented market [...]

The pilot project of PCB comprehensive wastewater deep treatment led by the Institute of Process Engineering of the Chinese Academy of Sciences was launched in Wuxi in December 2025. Through the three-level process of "electrocatalytic oxidation+gradient membrane separation+copper crystallization recovery", the heavy metal ion concentration is less than 0.05mg/L and the reuse rate is greater [...]

New energy vehicle electric drive, OBC (on-board charger), DC-DC converter and other power modules commonly use aluminum/copper based metal core printed circuit boards (MCPCBs), which conduct heat directly through the metal substrate, reducing the IGBT junction temperature by more than 20 ℃. Industry data shows that by 2025, the installation volume of MCPCB vehicles in [...]

According to industry estimates, the PCB value of a single 5G base station is about five times that of a 4G base station, mainly due to the increasing demand for multi-layer, high-frequency high-speed boards such as RF front-end, Massive MIMO antenna array, and high-speed return interface. However, the core formula and patents of upstream high-frequency [...]

Before the completion of the environmental impact assessment approval for the 200000 square meter printed circuit board technology renovation project of Weili Guang Technology, a public announcement was made, which clearly requires that organic waste gas be treated with water spray and secondary activated carbon, acidic waste gas be treated with dilute alkali washing tower, [...]

Since 2024, driven by downstream factors such as AI servers, 5G base stations, and optical modules, the PCB industry has shown a dual logic resonance of "cycle+growth", with the off-season output value in the first quarter exceeding 8% of the same period last year. High speed, high-frequency, high layer count, and high heat dissipation requirements [...]