Release Date: April 13, 2026 Against the background of accelerating penetration of new energy vehicles and intelligent driving systems, automotive-grade PCB has evolved into one of the most stable growth segments of the circuit board industry. Industry statistics indicate that the PCB consumption value of a single mid-to-high-end electric vehicle is 3–5 times that of [...]
Release Date: May 20, 2026 Focus on PCB Europe 2026, Europe’s most influential professional exhibition covering PCB design, fabrication, assembly and testing, successfully wrapped up its two-day event in Vicenza, Italy on May 14, 2026, with significantly increased exhibitor scale and cross-border visitor volume compared with previous sessions. The exhibition centered on two core industry [...]
Release Date: January 10, 2026 The European Commission formally implemented three major sustainable electronics regulatory frameworks on January 1, 2026, bringing comprehensive changes to design, production and export compliance for PCB products sold in the European market, under the Ecodesign for Sustainable Products Regulation (ESPR) and circular economy strategy. First, mandatory recyclability labeling is enforced [...]
Release Date: March 22, 2026 The global supply chain has launched supplier verification tests for the new-generation M10 copper-clad laminate material, tailor-made for next-generation high-performance AI computing platforms, marking the official entry of the PCB industry into the ultra-high-speed signal transmission era. Compared with traditional FR-4 substrates and previous M9 series materials, the newly defined [...]
Release Date: June 18, 2026 Prismark, a professional electronic industry research institution, released the latest global printed circuit board industry report recently. Statistics show that the total output value of the global PCB market surged 15.8% year-on-year to USD 85.2 billion in 2025. Driven by large-scale construction of AI data centers, high-speed communication and automotive [...]
The International Electronics Manufacturing Initiative (INEMI) has published updated PCB Laminate, Board Assembly, and Complex Integrated Systems Roadmaps, outlining key technology requirements and gaps through 2030. The updates prioritize AI computing, 5G/6G communications, autonomous vehicles, and aerospace applications. Key highlights include: A new laminate section detailing ultra-low-loss material specifications for 1.6T+ high-speed interfaces. Enhanced board [...]
The International Electronics Manufacturing Initiative (INEMI) has published updated PCB Laminate, Board Assembly, and Complex Integrated Systems Roadmaps, outlining key technology requirements and gaps through 2030. The updates prioritize AI computing, 5G/6G communications, autonomous vehicles, and aerospace applications. Key highlights include: A new laminate section detailing ultra-low-loss material specifications for 1.6T+ high-speed interfaces. Enhanced board [...]
The Printed Circuit Board Association of America (PCBAA) announced the introduction of a new U.S. Senate bill aimed at reshoring and revitalizing the domestic PCB industry, which has seen its global market share decline from 30% to 4% over the past 30 years due to offshoring. The legislation proposes tax incentives, grants, and tariff relief [...]
OKI Group has successfully developed 180-layer, 15 mm-thick PCB technology for high-bandwidth memory (HBM) wafer testing equipment used in AI semiconductors. This represents a 45% increase in layer count and doubled thickness compared to the company’s previous 124-layer, 7.6 mm design. The new PCB addresses the growing demand for higher density and more I/O channels [...]
In March 2026, NVIDIA initiated supplier qualification testing for M10, a next-generation copper-clad laminate (CCL) material designed for its Rubin Ultra and Feynman AI platforms—marking a pivotal shift toward ultra-high-speed, low-loss PCB technology. Compared to the current M9 material, M10 reduces signal loss by 30%–40% versus traditional FR-4, enabling stable transmission at speeds beyond 1.6 [...]