Uncategorized

Glass core substrates are being evaluated as an alternative to traditional organic PCB substrates for high-performance computing applications. According to recent industry technical research, glass-based substrates deliver better warpage control and improved signal integrity at speeds above 112 Gbps. While lab and prototype testing shows promising performance, mass production for server-grade applications is still targeted [...]

The global printed circuit board industry is undergoing structural changes fueled by massive investment in AI high-performance computing. AI server hardware requires multi-layer PCBs, some reaching 20–46 layers, together with low-loss dielectric materials to satisfy high-speed signal transmission. Industry analysis indicates the AI-related PCB segment will maintain a much higher growth rate than conventional rigid [...]

Published: August 15, 2026 As 1.6T and higher?speed optical?modules gradually enter mass production, the Modified Semi?Additive Process (MSAP) has become an essential manufacturing technology for high?speed circuit boards in optical?communication hardware systems. Traditional subtractive?etching PCB processes can hardly meet ultra?fine?line requirements, usually reaching a physical limit around 30?micron line?width. With thin seed?layer electroplating, MSAP technology [...]

Published: August 20, 2026 The global printed?circuit?board industry is experiencing obvious structural divergence in 2026, forming a two?tier market pattern. High?multi?layer, high?speed PCBs supporting AI servers, optical?modules and data?center hardware enjoy full?order books, while conventional low?to?mid?end PCBs for consumer electronics suffer from sluggish demand and fierce price competition. Leading investment institutions have sharply upgraded market [...]

Published: August 28, 2026 The global PCB?material supply crunch, once limited to high?frequency, high?speed substrates, has expanded to mainstream FR?4 copper?clad laminates and thick prepreg sheets, bringing wider pressure to the whole printed?circuit?board manufacturing sector. Major CCL suppliers have issued multiple rounds of price?increase notices in 2026. Several top laminate producers raised FR?4 prices by [...]

Published: August 31, 2026 Surging investment in artificial?intelligence data centers worldwide has caused a notable supply shortage of high?layer, high?speed printed circuit boards for AI servers and high?speed network equipment. Industry analysts estimate the global supply gap of premium server?grade PCBs reaches nearly 30% in 2026. Cloud?service providers are shifting hardware procurement from traditional GPU [...]

Published: May 19, 2026 Prismark Partners released its mid-year 2026 global electronics material forecast, projecting the total printed circuit board market will surpass $90 billion by year-end with a 5.2% compound annual growth rate. AI computing infrastructure and new energy vehicles act as the core demand drivers: a single high-end AI server requires 5x higher-value [...]

Published: July 2, 2026 The U.S. Department of Defense released an Advance Notice of Proposed Rulemaking (ANPR) to implement 10 U.S.C. § 4873, a statute set to launch January 1, 2027. The rule prohibits federal defense contractors from purchasing network-connected, mission-critical printed circuit boards fabricated in four restricted regions. A mandatory third-party geographic certification and [...]

Published: June 23, 2026 Three sustainable electronics regulatory frameworks under the ESPR took effect across the EU on January 1, 2026, introducing mandatory compliance rules for all circuit boards sold within the bloc. Key mandates include recyclability labeling for multi-layer PCBs, full Digital Product Passport (DPP) traceability covering raw mineral origins, and bans on three [...]

Published: May 15, 2026 The European Commission updated Annex XVII of the REACH regulation, cutting the allowable cobalt migration threshold in electronics from 500 ppm to 100 ppm, with full enforcement starting November 1, 2026. Cobalt is widely used in PCB surface plating, conductive adhesives and solder alloy additives. All electronics importers, chemical raw material [...]