As chip packaging density rises, IC substrates are evolving into one of the most high-value segments of the PCB industry. Fine-line, microvia, thin-core and high-aspect-ratio structures are widely adopted for flip-chip packages. Fabrication requires ultra-precise lithography, cleanroom control and advanced surface finish such as ImAg and ENEPIG. Supply chain capacity for high-end substrates remains tight amid semiconductor expansion. XJYPCB provides technical consultation and manufacturing support for HDI and substrate-like PCB products for packaging and chip test applications.
