The global market for high-layer, low-loss printed circuit boards keeps expanding as AI server and high-bandwidth networking deployments accelerate. New generation AI accelerators and 1.6T optical transceivers require PCBs with strict signal integrity, controlled impedance and ultra-low insertion loss. Advanced laminates, precision HDI structures and tight tolerance impedance control become standard requirements for high-performance computing hardware. XJYPCB continues to optimize its high-speed PCB fabrication workflow to support global customers in AI infrastructure, with stable delivery on backplane and high-layer board projects.
