OKI Group has successfully developed 180-layer, 15 mm-thick PCB technology for high-bandwidth memory (HBM) wafer testing equipment used in AI semiconductors. This represents a 45% increase in layer count and doubled thickness compared to the company’s previous 124-layer, 7.6 mm design.
The new PCB addresses the growing demand for higher density and more I/O channels in AI chip testing, driven by shrinking semiconductor process nodes and the integration of more HBM stacks per wafer. OKI plans to establish mass production lines at its Joetsu Plant in Niigata Prefecture, with commercial shipments starting in October 2026.
High-layer-count PCBs for semiconductor test equipment are a fast-growing niche, with demand rising as AI chipmakers ramp up production of advanced processors and HBM modules.