The global printed circuit board (PCB) market is entering a structural boom in 2026, fueled by exponential demand for AI computing power. According to industry analysts, the market size reached approximately $84.9 billion in 2025** (up 15% year-over-year) and is projected to grow **12%–15%** in 2026, surpassing **$94 billion and approaching the $100 billion milestone.
Growth is highly polarized: high-end segments—including high-layer-count boards, high-frequency/high-speed PCBs, and IC substrates—are expanding at 30%–50% annually, while low-cost, standard multilayer boards face margin pressure and oversupply. China remains the world’s largest production base, accounting for 53% of global output in 2025, with its share expected to rise to 54%–56% in 2026.
Driving the surge is the rapid deployment of AI servers, which require 30+ layer PCBs, ultra-low-loss materials, and advanced thermal management to support 800G/1.6T optical modules and high-bandwidth memory (HBM) integration.