Global electronic material industry associations have officially released updated technical standards for high-frequency and high-speed PCB substrates, targeting the large-scale mass production of next-generation AI server architectures. The new standards focus on low dielectric constant (low Dk) and low dielectric loss (low Df) substrate performance indicators, optimizing parameter specifications for high-speed signal transmission in ultra-large bandwidth computing scenarios.
With the rapid iteration of AI computing platforms, traditional ordinary PCB substrates can no longer meet the ultra-high-speed data transmission demands of server hardware. The updated standards unify the testing methods and performance thresholds for M9 and M10 grade copper clad laminate (CCL) materials used in PCBs, effectively solving the problems of signal attenuation and crosstalk in high-frequency operating environments. Industry analysts stated that the unified global standards will accelerate the popularization of high-performance PCBs in AI data center equipment, reduce industry technical differentiation, and further improve the stability and compatibility of high-end computing hardware.