RBP Chemical Technology will be holding a webcast on January 9, 2018 on troubleshooting printed wiring board defects. Led by Mike Carano, RBP Vice President of Technology and Business Development, this webcast series will explore the most intricate factors of advanced problem solving of printed circuit board defects and how the interrelationship of both up and downstream processes contribute to scrap product.
Defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away, carry significant costs. Many are difficult to solve because the root cause may not be readily apparent and multiple factors may contribute.
The webcast will discuss innerlayer surface preparation and imaging, including cleaning, resist lamination, exposure and developing, and fine line etching; lamination and related defects; and drilling issues and the effects on plating quality.