In-depth analysis: design and optimization of BGA package and PCB differential interconnection structure
Design and optimize the high-speed BGA package and PCB differential interconnection structure, focusing on the analysis of the differential wiring method of the package and PCB interconnection area, signal layout method, signal hole/ground hole ratio, wiring layer and via stubs. The specific impact of high-speed differential signal transmission performance and crosstalk. The full-wave electromagnetic field [...]