FPC flexible circuit board with wiring of high density, light weight, thin thickness, good bending property characteristics, widely used in smart phones, FPC flexible circuit board of the smart phone is mainly used for the connection parts and motherboard, display module, fingerprint module, camera module, antenna, vibrator, etc., as the camera to three, four taken taken grows, and the use of OLED screen, fingerprint module constantly infiltration, etc., the dosage of the FPC flexible circuit board will continue to increase.
As smartphones toward miniaturization, lightweight, muti_function change direction, FPC flexible circuit board has the characteristic such as lightweight, flexible, make its in the smartphone market share is getting higher and higher, but the FPC on processing, materials, flexible circuit boards, such as open circuit, short circuit may occur in the process of production, such as line width is not defective, so need to reliability test, FPC flexible circuit board test content including:
1. Thermal stress test: The so-called thermal stress test is to detect the heat resistance of FPC.

2. Bantian adhesion test: This test is to verify whether FPC eats tin well.

3. Environmental test (hot and cold shock) : The purpose is to verify whether FPC can maintain good performance in a harsh environment with sharp temperature changes.

4. Electroplating tightness test: This test is mainly to test whether the tightness of FPC is intact.

5. Environmental test (high temperature and humidity) : The purpose is to verify whether FPC can work normally in high temperature and humidity environment.

6. Winding test: Verify whether the bending Angle of FPC can maintain good performance.
FPC flexible circuit board performance testing is a fairly important role in the technological process, the test is the guarantee consumer rights and interests of a reflection, also is a kind of business reputation guarantee, so you need to quality and performance of FPC flexible circuit boards need to be strictly controlled, large current shrapnel micro needle module for FPC connector test has the effect of stable connection, can ensure the test efficiency of FPC connector.
The shrapnel microneedle module is applied to FPC flexible circuit board test. Its one-piece structure can make the resistance constant, and can transmit large current. The maximum current can withstand 50A, and the current transmission is stable within the range of 1-50A, with strong overcurrent capacity. In addition, the shrapnel microne module has an average service life of more than 20W times, which can efficiently cope with the FPC flexible circuit board test, with strong performance and no need for frequent replacement, which can not only improve the test efficiency, but also reduce the cost.
In the small pitch, the value range is between 0.15-0.4mm, with reliable performance and strong adaptability. There will be no pin or broken needle in the connection, and the performance is very good in the FPC flexible circuit board test.
FPC flexible circuit board has high test frequency and high demand for current, so the corresponding connection module can have the function of large current transmission, while the performance of large current shrapnel microne module can just meet the test demand of FPC flexible circuit board, and it is a highly reliable test connection module.