With the mass deployment of several giant low orbit satellite Internet projects around the world, the on-board electronic equipment has strict requirements for high-frequency, lightweight and irradiation resistant PCBs. The L/Ka band communication module commonly uses special substrates with extremely low dielectric loss (such as PTFE composite materials), and is combined with precision laser drilling [...]
A new hardware development model is emerging - engineers only need to input "design a low-power IoT control board that supports Wi Fi 6E and Bluetooth 5.3", and AI systems can automatically generate schematics and PCB layouts that comply with electrical specifications, and output Gerber files that can be delivered for production. This technology relies [...]
Standard multi-layer PCB manufacturing requires dozens of processes including inner layer graphic etching, lamination, through-hole metallization, outer layer electroplating, solder mask, character printing, surface treatment, and electrical testing. Its core lies in interlayer alignment accuracy and conductivity reliability, reflecting the precision manufacturing attributes of PCB as the "mother of electronic products".
With the increasing demand for AI servers, cloud computing, and 5G communication equipment, the market's technical requirements for high-frequency, high-speed, high-density interconnect (HDI), and packaging substrate PCBs continue to rise. The industry is shifting from traditional "cyclicality" to a dual wheel drive of "growth+cycle", driving the development of PCBs towards higher layers, smaller linewidths, and [...]
A laser drilling technology for ultra-thin semi cured films has obtained patent disclosure, which can achieve high-precision blind hole forming with aperture ≤ 75 μ m, and can be completed by single laser copper breaking without multi-step hole repair. Combined with the AOI automatic detection system, the intelligence level and quality consistency of micro hole [...]
A new fluorine free and lead-free tin plating process is being promoted to replace harmful substances in traditional PCB electroplating. This environmentally friendly process not only reduces the impact on the environment, but also improves the reliability of solder joints and the corrosion resistance of circuits, making it a key step in the green transformation [...]
China is breaking the foreign monopoly in the high-end panel field through printed OLED display technology. This technology uses a method similar to inkjet printing to deposit organic luminescent materials, which has more cost advantages and yield potential compared to traditional vapor deposition processes. It is considered an important path to achieve the localization of [...]
With the help of the NVIDIA Omniverse platform, manufacturers can conduct virtual simulation testing on the entire PCB production line before deployment, covering collaborative verification of mechanical, electrical, and control systems. This type of solution can compress the traditional on-site debugging cycle of several weeks to the hourly level, improving design verification efficiency by over [...]
Flexible PCBs are widely used in smart watches, AR/VR headsets, and instrument panels of new energy vehicles due to their lightweight and bendable characteristics. The polyimide substrate combined with copper foil conductor structure exhibits excellent electrical performance and temperature resistance, meeting the requirements of complex spatial wiring. With the evolution of consumer electronics towards diversified [...]
In advanced packaging and HDI board manufacturing, micro hole processing with blind hole diameter ≤ 75 μ m has become a bottleneck. The new laser drilling method completes the formation by high-precision copper breaking in a single pass, abandoning the traditional multi-step hole repair process, and combining with an automatic optical inspection system (AOI) to [...]