In March 2026, NVIDIA initiated supplier qualification testing for M10, a next-generation copper-clad laminate (CCL) material designed for its Rubin Ultra and Feynman AI platforms—marking a pivotal shift toward ultra-high-speed, low-loss PCB technology. Compared to the current M9 material, M10 reduces signal loss by 30%–40% versus traditional FR-4, enabling stable transmission at speeds beyond 1.6 [...]
The global printed circuit board (PCB) market is entering a structural boom in 2026, fueled by exponential demand for AI computing power. According to industry analysts, the market size reached approximately $84.9 billion in 2025** (up 15% year-over-year) and is projected to grow **12%–15%** in 2026, surpassing **$94 billion and approaching the $100 billion milestone. [...]
The electronic design automation (EDA) industry has ushered in a comprehensive intelligent upgrade, and AI-augmented EDA tools have begun to be widely applied in PCB design scenarios, completely changing the traditional manual-led circuit design mode. In the face of the increasingly complex ultra-high-density PCB wiring and multi-layer stack design requirements of consumer electronics and AI [...]
Global electronic material industry associations have officially released updated technical standards for high-frequency and high-speed PCB substrates, targeting the large-scale mass production of next-generation AI server architectures. The new standards focus on low dielectric constant (low Dk) and low dielectric loss (low Df) substrate performance indicators, optimizing parameter specifications for high-speed signal transmission in ultra-large [...]
The glThe global printed circuit board (PCB) market is set to reach $94–98 billion in 2026, growing at 12–15% year-over-year, fueled by explosive demand for AI infrastructure, data centers, and advanced electronics, according to industry analysts. AI servers are the primary growth engine: a single AI server requires 3–5 times more PCB volume and 8–12 [...]
April 9, 2026 — A significant technological milestone has been reached in the development of high-layer count printed circuit board backplanes, with successful research and validation of 70-layer+ midplane and orthogonal backplane PCBs for next-generation AI supercomputers. Independent technical testing institutions confirmed that the newly developed PCB backplanes achieve an exceptional layer-to-layer alignment precision of [...]
April 7, 2026 — The global printed circuit board industry is ramping up efforts to advance sustainable and environmentally responsible manufacturing practices, with a unified industry target to increase the adoption rate of halogen-free circuit board materials from 65% in 2025 to 85% by 2027. This initiative aligns with stringent global environmental regulations, including the [...]
April 8, 2026 — A recent analysis of the global electronics manufacturing supply chain reveals a notable geographic shift in printed circuit board production, with Southeast Asia’s cumulative PCB manufacturing capacity projected to reach 25% of the global total by the end of 2026. This structural shift is driven by evolving international trade dynamics, optimized [...]
April 11, 2026 — The global high-performance computing (HPC) industry has officially designated M9-grade high-speed materials as the universal industry standard for next-generation AI server printed circuit boards in 2026, marking a pivotal technological transition in the PCB materials sector. Independent material performance testing has verified that M9-grade laminates deliver ultra-low signal loss with a [...]
April 13, 2026 — A comprehensive industry research report released this week by an independent global technology market analytics institution has projected that the global printed circuit board (PCB) market will surpass $940 billion in valuation by 2026, registering a compound annual growth rate of 12% to 15% over the forecast period. The unprecedented market [...]