The rapid development of electronic information industry makes electronic products develop in the direction of miniaturization, functionalization, high performance and high reliability. From the general surface mount technology (SMT) in the mid-1970s to the high-density interconnect surface mount technology (HDI) in the 1990s, and the application of various new packaging technologies such as semiconductor packaging [...]
Modulation is the process of processing the coded information of the signal source to make it suitable for transmission. Generally speaking, this means that the baseband signal (source) is transformed into a band communication signal with a very high frequency relative to the baseband frequency. This band communication signal is called modulated signal, and the [...]
Communication equipment Communication equipment, 76 companies, with a total market value of 750 billion, pe57. The index has been quite weak in recent years. It reached a peak of 6500 in 2015 and fell below 2000 at the end of 2018. The peak in recent years has stopped at 3800 for three times. It has [...]
Brief description of QFN package QFN (quad flat no leads package) is a pin free package, which is square or rectangular. There is a large area of exposed pad in the center of the bottom of the package for heat conduction, and there are conductive pads for electrical connection around the package periphery of the [...]
PXI semiconductor test At present, with the rapid development of semiconductor industry, semiconductor test system has a wide range of market applications and considerable prospects. In the medical industry, military industry, aerospace industry, automotive electronics industry, memory industry and traditional instrument suppliers, there is a demand for semiconductor test systems. These industries are mainly concerned [...]
Some data show that compared with the domestic market, the demand for semiconductor chip bases and probes in 2019 is US $182million, accounting for only about 15% of the global market. This data is obviously inconsistent with China's annual consumption of about 33% of the global chips. It is understood that the data deviation here [...]
Technical content of reliability test equipment_ Market report on semiconductor chip packaging test socket and probe Some data show that compared with the domestic market, the demand for semiconductor chip bases and probes in 2019 is US $182million, accounting for only about 15% of the global market. This data is obviously inconsistent with China's annual [...]
Brief description of QFN package QFN (quad flat no leads package) is a pin free package, which is square or rectangular. There is a large area of exposed pad in the center of the bottom of the package for heat conduction, and there are conductive pads for electrical connection around the package periphery of the [...]
Whether military aircraft or civil aircraft, there will be several sets of communication equipment. Some are connected with satellites and some are connected with the ground. No matter what kind of connection, you need an antenna. Even a small four rotor UAV needs to be located through GPS antenna. Similarly, there are more and more [...]
CCL industry is in the middle of the whole PCB industry chain and provides raw materials for PCB industry. Copper clad laminate (CCL) is a kind of plate-like material made by impregnating, drying, cutting and stacking electronic glass fiber cloth or other reinforcing materials with resin adhesive, covering one or both sides with copper foil [...]