Application of HDI circuit board
Overview of printed circuit board HDI high density technology, application of HDI circuit board manufacturing technology (1) fine wire technology in the future high fine wire width/spacing will be 0.20mm-o.13mm-0.08mm-0.05mm, to meet the requirements of SMT and Multichip Package (MCP). The following techniques are therefore required. (1) due to the thin wire width of the [...]