FPC flexible circuit boards are widely used in smart phones due to their high wiring density, light weight, thin thickness, and good flexibility. The FPC flexible circuit boards in smart phones are mainly used for the connection of parts and the motherboard, like Display modules, fingerprint modules, camera modules, antennas, vibrators, etc., with the continuous upgrade of cameras to three-camera and four-camera, and the use of OLED screens, the continuous penetration of fingerprint modules, etc., the amount of FPC flexible circuit board Will continue to increase.
With the development of smart phones in the direction of miniaturization, portability, and multi-function, FPC flexible circuit boards have the characteristics of lightness and flexibility, making their market share in smart phones increasingly high, but FPC flexible circuit boards are Defects such as open circuit, short circuit, line width inconsistency, etc. may occur in the production process such as processing, loading, and mounting. Therefore, it is necessary to conduct reliability tests on FPC flexible circuit boards. The test contents include:
1. Thermal stress test: The so-called thermal stress test is to detect the heat resistance of FPC.
2. Handa adhesion test: This test is to verify whether the FPC eats tin well.
3. Environmental test (hot and cold shock): The purpose is to verify whether the FPC can maintain good performance in the harsh environment with rapid temperature changes.
4. Electroplating adhesion test: This test mainly tests whether the adhesion of FPC is intact.
5. Environmental test (high temperature and high humidity): The purpose is to verify whether the FPC can work normally in a high temperature and humid environment.
6. Folding test: to verify whether the FPC can maintain good performance.
The performance test of FPC flexible circuit boards is a very important part of the process. Testing is a manifestation of protecting the rights and interests of consumers and a guarantee of business reputation. Therefore, the quality and performance of FPC flexible circuit boards need to be strictly checked. , The high-current shrapnel micro-needle module has a stable connection effect for FPC connector testing, and can ensure the testing efficiency of FPC connectors.
The shrapnel micro-needle module is used in FPC flexible circuit board testing. Its integrated structure can make the resistance constant and can transmit large currents. The maximum withstand current is 50A, and the current transmission is very stable in the range of 1-50A. Strong flow ability. In addition, the shrapnel microneedle module has an average service life of more than 20W times, and can efficiently respond to FPC flexible circuit board testing. It has strong performance and does not require frequent replacement, which can improve testing efficiency and reduce costs.
In the small pitch, the value range is 0.15-0.4mm, the performance is reliable, and it has strong adaptability. There will be no pin or broken pins in the middle of the connection. The performance is very good in the FPC flexible circuit board test. .
The FPC flexible circuit board has a high test frequency and a large demand for current. The corresponding connection module needs to have a large current transmission function, and the performance of the high current shrapnel micro-needle module can meet the test requirements of the FPC flexible circuit board. A highly reliable test connection module.