With the development of smart phones in the direction of miniaturization, portability and multi-function, FPC flexible circuit board has the characteristics of portability and flexibility, which makes its market share in smart phones more and more high. However, FPC flexible circuit board may have defects such as open circuit, short circuit, line width discrepancy and so on in the process of processing, feeding and mounting. Therefore, it is necessary to analyze FPC flexible circuit board Reliability test, including:
1. Thermal stress test: the so-called thermal stress test is to detect the heat resistance of FPC.
2. Half field adhesion test: this test is to verify whether the FPC eats tin well.
3. Environmental test (cold and hot impact): the purpose is to verify whether FPC can maintain good performance in the harsh environment with rapid temperature change.
4. Plating adhesion test: the test is mainly to test whether the FPC adhesion is intact.
5. Environmental test (high temperature and high humidity): the purpose is to verify whether FPC can work normally in high temperature and humid environment.
6. Winding test: to verify whether the FPC can keep good performance in winding and bending angle.
The performance test of FPC flexible circuit board is a very important link in the process. The test is an embodiment of protecting the rights and interests of consumers, and also a guarantee of the reputation of businesses. Therefore, the quality and performance of FPC flexible circuit board need to be strictly controlled. The high current shrapnel microneedle module has a stable connection function for FPC connector test, which can ensure the test performance of FPC connector Test efficiency.
The shrapnel microneedle module is used in FPC flexible circuit board test. Its integrated structure can make the resistance constant, and can transmit large current. The maximum withstand current is 50a, and the current transmission is very stable in the range of 1-50a, with strong over-current ability. In addition, the shrapnel microneedle module has an average service life of more than 20W times, which can effectively cope with FPC flexible circuit board test. It has strong performance and does not need to be replaced frequently. It can not only improve the test efficiency, but also reduce the cost.