Modern has very high requirements for electrical appliances and electronics. It must be safe to use, otherwise it cannot enter the market in large quantities. In order to avoid power connection between circuit board and circuit, circuit board potting adhesive is generally used for potting. The potted circuit board is wrapped by adhesive layer, which greatly reduces the pollution between circuit and circuit.
What’s the use of circuit board potting glue?
1. While the circuit board potting glue plays the role of potting, it can adhere the circuit with the glue liquid, eliminate the adverse reactions caused by vibration and impact, and make it safer to use. Even if there is a slight collision, it will not affect the use.
2. The cured circuit board potting adhesive can better play the role of “protection”, can resist the influence of ultraviolet rays on electronic components, has weather resistance, can resist the alternation of four seasons even outdoors, and the service performance remains unchanged.
What are the characteristics of circuit board potting adhesive?
1. After the electronic components are potted, they have good waterproof and moisture-proof performance. It can prevent the use of electrical or electronic products from being affected by moisture.
2. Although it belongs to chemical glue, it has no corrosiveness to metal, and its performance is safe and reliable. General circuit boards can be potted.
3. The use of circuit board potting adhesive can ensure the working stability of electronic products, give play to good insulation performance, ensure the safety of electronic use, and is not prone to power connection risk.
4. Circuit board potting adhesive has good fluidity in the process of use and can be leveled automatically. It can achieve good potting effect whether it is manual construction or machine construction.
5. Circuit board potting adhesive is detachable after curing, which is different from epoxy potting adhesive. The encapsulated electronic components can be disassembled and replaced at any time in case of failure. After replacing the new components, they can be used normally without leaving any trace.
