1、 The difference between ceramic substrate and PCB board
1. The materials are different. Ceramic substrates are inorganic materials, with the core being aluminum trioxide or aluminum nitride; The ordinary PCB board uses FR4 fiberglass board, which is an organic material. Ordinary pcb boards can be laminated in multiple layers. LTCC is the mainstream of ceramic multilayer circuit boards. The ceramic multilayer process currently being developed by United Multilayer Circuit Board Co., Ltd. is different from the traditional method. A layer of ceramic medium is grown on the ceramic circuit board that has been metallized with the new technology of Magnetron sputtering, and then the second layer of circuit is fabricated by re metallization on this layer of medium.
2. The performance and application of ceramic substrates are different. The thermal conductivity of ceramic substrates far exceeds that of ordinary PCB boards, with alumina ceramics having a thermal conductivity of ≥ 25W/(m · K) and aluminum nitride ceramics having a thermal conductivity of ≥ 170W/(m · K). They are used in industries with high heat dissipation needs, such as high-power LED lighting, high-power modules, high-frequency communication, rail power supply, etc; The coefficient of thermal expansion of the ceramic substrate is more matched with the silicon chip, and the product stability is higher. Ordinary PCB boards are widely used, mostly in private commercial goods.
2、 Differences between ceramic substrates and high-frequency boards
1. Different materials. The ceramic substrate is made of aluminum trioxide or aluminum nitride, while the high-frequency board is mostly made of Rogers, Yaron, polytetrafluoroethylene, etc., with low dielectric constant and fast high-frequency communication speed.
2. Different performance. Ceramic substrates are widely used in fields such as refrigeration chips and systems, high-power modules, and automotive electronics. High frequency PCB boards are mainly used in the field of high-frequency communication, aviation, high-end consumer electronics, etc.
3. The field of high-frequency communication involves heat dissipation needs, usually requiring a combination of ceramic substrates and high-frequency PCB boards, such as high-frequency ceramic PCBs.