The abbreviation of Flexible Printed Circuit is FPC, also known as flexible circuit board, flexible circuit board, flexible circuit board, flexible printed circuit board, flexible circuit board, referred to as flexible board or FPC, has high wiring density, good flexibility, It can be bent, light weight and thin.
Mainly used in many products such as notebook computers, mobile phones, LCM, LCD, PDA, digital cameras and so on.
FPC flexible printed circuit is made of polyimide or polyester film as a substrate with high reliability and excellent flexible printed circuit.
1. It can be bent, folded and wound freely, and can be freely moved and stretched in three-dimensional space.
2. Good heat dissipation performance, F-PC can be used to reduce the volume.
3. Realize light weight, miniaturization and thinness, so as to achieve the integration of component device and wire connection.
Digital cameras, mobile phone screens and batteries, MP3, MP4 players, medical, automotive and aerospace fields
FPC becomes an important variety of epoxy copper clad laminate
Flexible copper clad laminates (FPC) with flexible functions and epoxy resins as substrates are becoming more and more widely used due to their special functions. They are becoming an important variety of epoxy resin-based copper clad laminates. But our country started late and needs to catch up.
Since the realization of industrial production, epoxy flexible printed circuit boards have experienced more than 30 years of development. Until the late 1980s, due to the advent and application of a new class of polyimide film materials, flexible printed circuit boards made FPCs appear adhesive-free FPC (generally referred to as “two-layer FPC”) . In the 1990s, a photosensitive cover film corresponding to high-density circuits was developed in the world, which made FPC design change a lot. Due to the opening up of new application areas, the concept of its product form has undergone no small changes. Among them, it has been expanded to include a larger range of substrates for TAB and COB. The high-density FPC that emerged in the second half of the 1990s began to enter large-scale industrial production. Its circuit graphics are rapidly developing to a more fine-grained level, and the market demand for high-density FPC is also rapidly increasing.