In the initial stage of debugging and the maintenance stage of the circuit board, the replacement and replacement of components are encountered. Disassembling the components is a technically hard work. If you pay attention to it, it will cause damage to the disassembled components. Even damaged the pad. The electronic components are sensitive to temperature. If the temperature is too high and the soldering iron stays for too long, the components will be damaged, resulting in failure to work on other boards. This damage may be partial damage, some functions are intact, and some functions are available. A problem has caused the debugging difficulty to increase.
What issues should you pay attention to when disassembling components?

1. The temperature of the soldering iron should not be too high and the residence time should not be too long.
The higher the temperature of the soldering iron, the easier the solder melts, but it is also more likely to damage the chip. Therefore, no matter what kind of package is used during disassembly, the soldering iron should be adjusted in real time.

2. To match the use of various tools
It is not enough to rely solely on the soldering iron when disassembling. It should be used in conjunction with tweezers, air guns, and soldering devices. For chips with fewer pins, the soldering iron can do a good job. If it is a multi-pin package, such as LQFP100, it is best to use a hot air gun to blow. When blowing, pay attention to temperature and wind speed, and the air gun should keep moving. If it is a direct-in type package with many pins, you need to use a soldering tin to match.

The above is the answer to this question, thank you for your comments, comments, and forwarding. More electronic design, hardware design, microcontroller and other content, please pay attention to this headline number: play embedded. Thank you everyone.