Printed circuit boards, also known as printed circuit boards, are suppliers of electrical connection of electronic components. Printed circuit board is usually represented by “PCB”, but not “PCB”. In this article, we will talk about several common standards of printed circuit board.
Several common standards of printed circuit board
1) Ipc-esd-2020: Joint standard for the development of ESD control program. Including all necessary planning, establishment, completion and protection of ESD control procedures. Based on the historical experience of some military and commercial organizations, the teaching of treatment and protection in ESD sensitive period is provided.
2) Ipc-sa-61 A: cleaning manual in half water after welding. It includes all aspects of semi-aqueous cleaning, including chemical, production residues, equipment, process, process control, and environmental and safety considerations.
3) Ipc-ac-62a: manual for cleaning water after welding. Describe the cost of manufacturing residues, types and properties of water-based cleaners, the process of water-based cleaning, equipment and process, quality control, environmental control and the safety of employees and the measurement and determination of cleanliness.
4) Ipc-drm-40 e: see manual for the table of through hole welding point evaluation. In addition, the 3D graphics generated by the accounting machine are also included in the detailed description of components, hole walls and welding surface covering according to the standard requirements. It covers tin filling, contact angle, tin dip, vertical filling, pad covering and a large number of welding point defects.
5) Ipc-ta-722: welding technology evaluation manual. It includes 45 articles on all aspects of welding technology, which covers ordinary welding, welding materials, manual welding, batch welding, wave peak welding, reflow welding, gas phase welding and infrared welding.
6) Ipc-7525: template planning strategy. The guidelines for the planning and manufacturing of solder paste and surface adhesive coating templates are also discussed. I also discuss the template planning using surface mounting technology, and introduce the components with through holes or flip chip components? Kunhe technology, including overprint, double printing and stage template planning.
7) Ipc/eia j-std-004: standard requirements for flux I include Appendix I. It includes the technical guidelines and classification of rosin and resin, organic and inorganic flux classified according to the content and activation degree of halide in flux; It also includes the application of flux, the substance containing flux and the low residue flux used in the cleaning free process.
8) IPC / EIA j-std-005: standard requirements for solder paste I include Appendix I. The characteristics and technical requirements of solder paste are listed, including inspection methods and metal content standards, as well as the functions of stickiness, collapse, solder balls, stickiness and solder paste.
9) IPC / EIA j-std-0 06A: standard requirements for electronic grade solder alloys, flux and non flux solid solder. It is an electronic grade solder alloy, a rod, strip, powder flux and non flux solder. It is the application of electronic solder. It provides terminology naming, standard requirements and inspection methods for special electronic grade solder.
10) Ipc-ca-821: General requirements for thermal conductivity binder. It includes the requirements and inspection methods for bonding components to the appropriate thermal conductive dielectric.
11) Ipc-3406: introduction of adhesive applied to conductive surface. In electronic manufacturing, the selection of conductive binder as an alternative to solder is provided.
12) Ipc-aj-820: assembly and welding manual. Including description of inspection technology for assembly and welding, including terms and definitions; See and outline for types of printed circuit boards, components and pins, welding point materials, component equipment and planning standards; Welding technology and packaging; Cleaning and coating; Quality assurance and inspection.
13) Ipc-7530: temperature curve of batch welding process (reflow welding and wave peak welding). In the acquisition of temperature curve, various inspection methods, techniques and methods are selected to provide instruction for the establishment of the best graphics.
14) Ipc-tr-460a: cleaning list of wave peak welding defects of printed circuit board. A list of modifications recommended for defects that may be caused by wave soldering.
15) IPC/EIA/JEDEC J-STD-003A。 Welding inspection of printed circuit board.
16) J-std-0 13: application of SGA and other high density technologies. To establish the standard requirements and interactions required for the PCB packaging process, to supply information for high-power and high-pin number integrated circuit packaging interconnection, including planning principle information, material selection, board manufacturing and assembly technology, inspection methods and reliability expectations based on the final application of the environment.
17) Ipc-7095: the planning and assembly process of SGA devices. It provides various useful operation information for people who are using SGA devices or considering switching to array packaging method; Provide instruction and supply reliable information on SGA area for SGA testing and repair.
18) Ipc-m-i08: cleaning instruction manual. Include the latest edition of other IPC cleaning instruction to assist manufacturing engineers in determining the cleaning process and defect cleaning of the products.
19) Ipc-ch-65-a: cleaning strategy in PCB assembly. For the supply of cleaning methods now made and emerging in the electronic industry, see, including descriptions and discussions on various cleaning methods, and explain
The connection between various materials, processes and pollutants in manufacturing and assembly operations.
20) Ipc-sc-60a: cleaning manual for solvent after welding. The application of solvent cleaning technology in automatic welding and manual welding is given. The properties, residues, process control and environment of solvents are discussed.
21) ipc-9201: Manual of surface insulation resistance. It includes the terms, theories, inspection process and inspection methods of surface insulation resistance (SIR), as well as temperature, humidity (th) inspection, defect form and defect
clean.
22) ipc-drm-53: refer to the manual for the electronic assembly desktop. Illustration and photo of the technology used to illustrate through hole equipment and surface mounting equipment.
23) ipc-m-103: manual standard for surface mounting equipment. This section includes all 21 IPC documents for surface mounting.
24) ipc-m-i04: Standard for assembly manual of printed circuit board. It includes 10 most widely used documents on PCB assembly.
25) ipc-cc-830b: function and identification of electronic insulation compounds in PCB assembly. The protective coating meets an industrial standard of quality and qualification.
26) ipc-s-816: technical process strategy and list of surface mounting. The defect cleaning strategy lists all kinds of process problems and solutions encountered in the surface mounting and assembly, including bridging, missing welding, uneven placement of components and components.
27) ipc-cm-770d: introduction to components and equipment of printed circuit board. Useful instruction is provided for the preparation of the component in PCB assembly, and the relevant standards, influence and distribution are reviewed, including assembly technology (including manual and automatic and surface mount technology and flip chip assembly technology) and consideration of subsequent welding, cleaning and coating process.
28) ipc-7129: accounting for the number of defects per million times (DPMO) and the assembly and manufacturing policy of printed circuit board. The benchmark policy agreed by the relevant industrial departments on Accounting defects and quality; It counts
The benchmark policy for the number of defects per million times provides a satisfactory method.
29) ipc-9261: output estimation of PCB assembly and defects occurring every million times during assembly. The reliable method to calculate the number of defects per million times in PCB assembly is defined as the measurement standard for evaluation in each stage of assembly process.
30) ipc-d-279: planning strategy for PCB assembly of reliable surface mounting technology. The reliability manufacturing process strategy of PCB with surface mount technology and hybrid technology, including planning thinking.
31) ipc-2546: combination requirements for key points in PCB assembly. The material motion system is described, such as the actuator and buffer, manual placement, automatic screen printing, binder automatic distribution, automatic surface mounting, automatic plating through hole placement, forced convection, infrared reflux furnace and wave peak welding.
32) ipc-pe-740a: defect cleaning in the manufacture and assembly of printed circuit board. Including case records and proofreading activities of printed circuit products in the planning, manufacturing, equipment and inspection process.
33) ipc-6010: series manual of quality standard and functional standard of printed circuit board. Including the quality standards and functional standards developed by the American PCB Association for all PCB.
34) ipc-6018a: Inspection and inspection of printed circuit board of microwave products. Including the high frequency (microwave) printed circuit board function and qualification requirements.
35) ipc-d-317a: guidelines for the selection of high-speed technology electronic packaging planning. Provide instruction for planning of high-speed circuits, including mechanical and electrical considerations and functional verification.
What is the standard of PCB? The introduction of several common standards of PCB, I hope that it can help you to learn more PCB information and pay attention to the update of the lapel.
