The process of PCB board copying is to realize the rapid update, upgrading and secondary development of various electronic products by extracting some modifications and modifications in the technical data files. According to the document drawings and schematic diagrams extracted from board copying, upgrading and optimization can be carried out!
What are the reverse steps for PCB copy? I believe many people have questions. Today, Jingke Yulong will answer them with you!
The reverse push steps of PCB circuit board are as follows:
1. Record relevant details of PCB board
Take a PCB board and record the model, parameters and position of all components on the paper, especially the direction of diodes, triodes and notches. Two component position photos can be taken with a digital camera. The higher the level of circuit board copying, some diode triodes are not noticed and can not be seen at all;
2. Scanned image
Remove all equipment and tin from pad holes. The PCB board is washed with alcohol and then put into the scanner. During scanning, the scanned pixels need to be slightly adjusted to obtain a clearer image. Gently polish the upper layer and bottom with gauze paper until the copper sheet shines, put it into the scanner, start PS, and sweep the two layers in color respectively;
3. Corrected image
Adjust the contrast and brightness of the picture to make the parts with and without copper film have strong contrast, then change the secondary picture to black and white, and check whether the lines of the circuit board are clear. If not, repeat this step;
4. Check position coincidence
Convert the two BMP format files into Protel format files and Protel files respectively. For example, pad and via basically coincide through the two layers of pad and via, indicating that the previous steps are well done. If there is any deviation, repeat step 3. Therefore, PCB board copying is a very patient work, because a small problem on the circuit board will affect the quality and matching of PCB board copying;
5. Draw layer
Convert the BMP of the top layer into toppcb, and pay attention to convert it into silk layer, that is, the yellow layer. Then you just put it on the top layer and place the device according to the drawing. When you finish drawing, delete the silk layer. Repeat until all layers are drawn;
6. Check
Check whether the electronic technical performance of the board is the same as that of the circuit board.