With the continuous progress of science, the main characteristics of PCB circuit boards for mobile communication terminals in the 5G era are:

High density: In the design of mobile terminals, every millimeter of space saved can create huge value for end customers. By saving space, you can use larger, higher-resolution displays, larger batteries, and more complex processors and components. All of these can enhance the functionality of the device and enhance the overall user experience.

High frequency and high speed: With the advent of the 5g era, the obvious change in circuit board performance is high frequency and high speed. As 5g, Internet of Things and other applications will adopt higher frequencies, it will gradually rise from below 3GHz to 6GHz and even 24-30gh22. Considering the higher resonance frequency of 5g, stricter impedance control is required. If it is not formed in a very high-precision form, the thin wires of the 5GPCB circuit board are likely to increase the risk of signal attenuation coefficient and reduce data integrity.

High heat generation: “Impedance” and “dielectric loss” exist in PCB signal transmission. With the increase of high frequency or high speed digitization and high power of the signal, the PCB continues to heat up. The first phase of my country’s 5g commercial frequency band is mainly concentrated below 6GHz, and the latter will reach 24-30GHz. As the 5g transmission rate continues to increase, the amount of data transmission will greatly increase. In addition, the emergence of applications such as 3D video, cloud gaming and wireless charging, these factors will lead to a significant increase in the heating capacity of 5g communication terminals compared to the 4G era.