Outlook for global PCB industry in 2019 will continue to grow, with 5 g, automotive, networking, artificial intelligence and other new application of booming development, more market opportunities and challenges, including high frequency PCB for the rigid demand, PCB to achieve high frequency is the key to the high frequency copper clad materials (such as PTFE (Polytetrafluoroethylene, PTFE) and Hydrocarbon (Hydrocarbon) and PCB manufacturers such as process itself. PCB industry challenges are the tightening of raw material supply and the increasingly stringent environmental protection policies. As a result, the threshold of PCB industry gradually becomes higher and the industrial concentration degree is gradually expanding.
In 2017, the global PCB output value is 58,843 million us dollars, and the output value in the communication field accounts for 27.5%. For market participants, there are Taiwan factories such as zhending, xinxing, huatong and jianding. PCB manufacturers with strong competitiveness in the communication field include Mektron, Sumitomo, Fujikura, Ibiden, TTM, SEMCO, ISU PETASYS, Sanmina, etc. At present, the global IC board manufacturers are mainly concentrated in Japan, South Korea and Taiwan, and most manufacturers have production bases in China.
5 g build growth will drive the PCB industry, PCB board as the “mother of the electronic products, the downstream application covers communication, mobile phone, computer, automobile electronic products, such as 5 g technology development is positive impact to the PCB terminals and base stations to increase total demand, coupled with the unit terminal, base stations used in PCB area, then drive the PCB whole industry needs improvement.
On the PCB technology development at present, in addition to the new technology of production process of fine lines, the company began to develop advanced Micro – LED PCB process with high-frequency high-speed HDI products technology, in the field of loading board is put into high frequency sealing loading plate of the Internet application, super fine lines of loading plate technology, and thin, for the high density superfine line of Coreless loading plate technology, in order to respond to 5 g, IoT and the development of AI, and related products to accelerate into the element of loading plate sealing technology.
Observe the overall industrial development trend, the global PCB industry to advance towards the direction of High Density, High precision and High reliability, continuously reduce costs, improve performance, reduced volume, light weight, thin, increase productivity and reduce the impact on the environment, to adapt to the electronic terminal equipment industry development, on the lower reaches of the HDI (High Density Interconnect), FPC (Flexible Printed Circuit), combined just scratch board and IC board, and will be the focus on future development.