Joint standard for electrostatic discharge control program development. Including the design, establishment, implementation and maintenance of esd control program. Based on the historical experience of some military and commercial organizations, this paper provides guidance for the treatment and protection of esd sensitive period.


After welding half water into the cleaning manual. Includes all aspects of semi-aqueous cleaning, including chemical, production residues, equipment, process, process control, and environmental and safety considerations.


After welding water cleaning manual. Describe the cost of manufacturing residues, types and properties of hydrogenous cleaners, hydrogenous cleaning processes, equipment and processes, quality control, environmental control and employee safety, as well as measurement and measurement of cleanliness.


Through hole welding spot evaluation desktop reference manual. Detailed descriptions of components, hole walls, and welding surface coverage are provided in accordance with the standard requirements, in addition to computer-generated 3D graphics. It covers tin filler, contact Angle, tin-dipping, vertical filling, pad cover and a large number of solder joint defects.


Welding technology Assessment Manual. It includes 45 articles on various aspects of welding technology, covering common welding, welding materials, manual welding, batch welding, wave soldering, reflow soldering, gas phase welding and infrared welding.


Guide to template design. Provides guidelines for the design and manufacture of solder paste and surface-mount binder coating formwork I also discusses the design of formwork using surface-mount technology and introduces components with through holes or flip chips. Kunhe technology, including overprint, double – print and stage template design.


Flux specification Requirements I include Appendix I. Technical specifications and classifications including rosin, resin, organic and inorganic flux according to halide content and degree of activation in flux; Also included is the use of flux, substances containing flux, and low-residue flux used in the clean free process.

Solder paste specification requirements I include Appendix I. The characteristics and technical specifications of the solder paste are listed, including test methods and standards for metal content, as well as viscosity, collapse, solder ball, viscosity and solder paste tin performance.


Specification requirements for electronic grade solder alloys, flux and non-flux solid solder. For electronic grade solder alloys, for bar, strip, powder flux and non-flux solder, for electronic applications, provides terminology, specification requirements and test methods for special electronic grade solder.


General requirements for thermal conductive adhesives. This includes requirements and testing methods for bonding components to thermally conductive dielectric in appropriate locations.


Guide for conductive surface Coating adhesives. To provide guidance for the selection of conductive adhesives as solder alternatives in electronic manufacturing.


Assembly and welding manuals. Contains a description of the inspection techniques for assembly and welding, including terms and definitions; Reference and outline of printed circuit boards, components and pins types, welding point materials, components installation and design specifications; Welding technology and packaging; Cleaning and film coating; Quality assurance and testing.


Guide to temperature curves for batch welding processes (reflow and wave soldering). Various testing methods, techniques and methods are used to obtain the temperature curve to provide guidance for the establishment of the best graph.


Troubleshooting list of wave soldering on printed circuit board. A recommended list of corrective actions for faults that may be caused by crest welding.


Test the weldability of printed circuit boards.


Application of ball foot lattice array encapsulation (SGA) and other high density techniques. Establish specification requirements and interactions required for PCB packaging processes to provide information for high performance and high pin number IC packaging interconnections, including design principles, material selection, board manufacturing and assembly techniques, test methods, and reliability expectations based on end-use environments.


SGA device design and assembly process supplement. Provides a variety of useful operational information for people who are using SGA devices or considering moving to array encapsulation; Provide guidance for SGA testing and maintenance and provide reliable information in the SGA field.