In 2011, the total global share of the world’s top 30 PCB companies was 49.8%, which increased to 60.5% in 2017. The market concentration increased significantly. The market share of leading PCB companies in China has been significantly improved, from 2.7% in 2011 to 6.1% in 2017, shennan circuit from 0.6% in 2011 to 1.4% in 2017, and shennan circuit from 0.37% in 2011 to 1.06% in 2017.
PCB industry has obvious advantages of late development. The new production line has a high degree of automation, fewer employees, advanced technology and high production efficiency, and the old production line will be eliminated naturally. In the future, with the tightening of environmental protection policies and financial pressure, the living environment of small and medium-sized enterprises will become more and more difficult, and resources will be inclined to the leading companies in the industry, and the market concentration will be further enhanced. PCB industry steady growth, concentration, second, third quarter ushered in demand season.
Although PCB industry in the next few years compound growth rate of only 4%, but the market space is large, global has $63 billion in 2018, coupled with the industry further transfer to China, foreign companies gradually give up, and domestic small and medium-sized enterprises due to environmental protection and capital pressure, integrating the takeover or exit the market, excellent management, advanced technology, the application field competition is better, continuous development of high-end products industry leading companies will continue to benefit from.
The world has entered a new generation of heats of 5 g communications, successive statements in Japan and South Korea, the United States and actively strive for commercial operation in this year and into next year, thanks 5 g communication technology gradually mature, 5 g communication transmission rate, the existing 4 g upgrade 10-100 times, under the high speed transmission, depends on the degree of high frequency, high speed antenna module is aggravating, related the application of new materials of 5 g communication trends, become this year the original and soft panel factory important new business opportunities.
Transmission speed than the current 4 g, 5 g high-speed transmission application of amplification effect, will not only on the consumers’ mobile phones and other portable equipment, also include artificial intelligence, intelligent household, Internet of things, and even car device application, etc., will be far more mobile phones and other handheld device for fast, which respond to high frequency wireless transmission antenna group, more critical position.
[Japan’s PCB output increased for two consecutive years last year, with the growth rate expanding; soft board dropped by 13%]According to the Japan Electronics Packaging Circuits Association; Japan printed circuit board (PCB) in December 2018; Japan printed circuit board (PCB) in December 2018; Compared with the same month last year, the output of hardboard, soft board and module substrate decreased by 2.7% to 1,166,000 square meters, the fourth decline in five months. Output rose 1.3 percent to 39.37 billion yen, the second straight monthly increase.
In terms of categories, Japan’s Rigid PCB output fell 2.5% in December from the same month a year earlier to 832,000 square meters, the first contraction in six months. Output rose 5.5 percent to 26.206 billion yen, the 15th straight month of growth.
Production of Flexible PCB declined by 7.2% to 261,000 sq m, the 19th consecutive month of contraction; Output plunged 13.3 percent to 4.439 billion yen, the fifth straight monthly decline.
2. Output of Module Substrates increased by 15.7 per cent to 73,000 sq m, for the second consecutive month; Output fell 1.8 percent to 8.725 billion yen, the fifth straight monthly decline.