Multilayer circuit board processing technology is subdivided into many types of technology, we will introduce the multilayer circuit board processing technology types:

Surface technology: hot air leveling (HAL), gold finger, Lead free spraying (Lead free), chemical (precipitation) gold, silver/tin, OSP, rosin treatment, etc.

● reliability test: open/short circuit test, impedance test, weldability test, thermal shock test, metallographic microsection analysis, etc

Color: green, black, blue, white, yellow, red, etc

● character color: white, yellow, black, etc

● plated plate: > or =5 microns

● tin spray: > or =2.5-5 micron

●V cutting: Angle: 30 degrees, 35 degrees, 45 degrees depth: plate thickness 2/3

● special process: blind buried hole, HDI, carbon oil filling hole, goldfinger, BGA, module board, motherboard, etc