Release Date: March 22, 2026
The global supply chain has launched supplier verification tests for the new-generation M10 copper-clad laminate material, tailor-made for next-generation high-performance AI computing platforms, marking the official entry of the PCB industry into the ultra-high-speed signal transmission era.
Compared with traditional FR-4 substrates and previous M9 series materials, the newly defined M10 material can reduce signal loss by 30%~40%, perfectly matching the strict high-speed transmission and heat dissipation demands of 800G and 1.6T optical modules, orthogonal backplanes and high-layer server motherboards. The material will be mainly applied to mainboard interconnection boards of high-end AI computing systems. According to industry plans, relevant verification work will be completed within 18 months, and mass production will start in the second half of 2027. In the medium and long term, the popularization of low-loss high-frequency materials will raise the technical threshold of high-end PCB manufacturing, and the delivery cycle of PCBs above 20 layers has extended to 8–12 weeks amid tight global supply capacity.