Published: August 15, 2026
As 1.6T and higher?speed optical?modules gradually enter mass production, the Modified Semi?Additive Process (MSAP) has become an essential manufacturing technology for high?speed circuit boards in optical?communication hardware systems.
Traditional subtractive?etching PCB processes can hardly meet ultra?fine?line requirements, usually reaching a physical limit around 30?micron line?width. With thin seed?layer electroplating, MSAP technology stably achieves conductor traces narrower than 20 ?m and improves impedance?control tolerance from ±10% to ±5%, greatly enhancing high?speed?signal integrity for data?transmission equipment.
High?speed CCL materials at the M8?M10 performance level are now the main competitive focus among PCB material suppliers. Market research predicts the global high?speed optical?module market will maintain rapid growth until 2030. PCB manufacturers that complete MSAP production?line upgrades in advance will secure long?term orders from optical?communication and AI?infrastructure customers.