Cutting and grinding ? drilling positioning holes ? inner layer graphics ? inner layer etching ? inspection ? blackening ? lamination ? drilling ? heavy copper thickening ? outer layer graphics ? tin plating, etching tin removal ?
Secondary drilling ? inspection ? screen printing solder mask ? gold-plated plug ? hot air leveling ? silk screen characters ? shape processing ? test ? inspection.
5. Process flow of multilayer nickel-plated PCB
Cutting edge grinding ? drilling positioning hole ? inner layer pattern ? inner layer etching ? inspection ? blackening ? lamination ? drilling ? heavy copper thickening ? outer layer pattern ? gold plating, film removal and etching ?
Secondary drilling ? inspection ? silk screen solder mask ? silk screen characters ? shape processing ? test ? inspection.
6. Process flow of multi-layer board immersed nickel gold pcb board
Cutting edge grinding ? drilling positioning hole ? inner layer pattern ? inner layer etching ? inspection ? blackening ? lamination ? drilling ? heavy copper thickening ? outer layer pattern ? tin plating, etching tin removal ?
Secondary drilling?inspection?screen printing solder mask?chemical immersion nickel gold?screen printing characters?shape processing?test?inspection.