Two, two business models shine: large – volume board market win in the scale, small – volume board gross margin win
(I) according to different requirements of downstream customers, PCB is divided into template and batch board
According to the different requirements of downstream customers, PCB is divided into template and batch board. According to the size of a single order area, batch board can be divided into small batch board and large batch board. According to Prismark’s statistics, the percentage of production value of large batch board, small batch board and sample board in the global PCB market in 2016 was 80-85%, 10-15% and 5% respectively. First, PCB industry process management and cost control ability is the top priority
PCB (PrintedCircuitBoard, PrintedCircuitBoard) is called “the mother of electronic products”, it is the indispensable electronic components in modern electronic information products, widely used in communication equipment, automotive electronics, consumer electronics, computers, aerospace, network equipment, industrial control and medical industry and other industries.
The working principle of PCB is to use the insulating material on the board to separate the copper foil conductive layer on the surface, so that the current flows in various components along the pre-designed route to complete such functions as work, amplification, attenuation, modulation, demodulation, coding and so on. In the most basic PCB, parts are concentrated on one side and wires on the other.
Copper clad plate is the most important substrate, which directly affects the performance of PCB. The main upstream raw materials of PCB are copper clad plate, rolled copper foil, semi-cured sheet, gold salt, etc., accounting for more than 60% of the total cost of PCB.
The upstream materials of copper clad plate are mainly resin, glass fiber cloth/glass fiber felt, filler, copper foil and aluminum plate, etc.
The substrate and process determine the performance of PCB sheet, and the precision of process determines whether the PCB sheet can meet the performance parameters. There are six main performance parameters of PCB board, including dielectric constant (Dk), transmission loss factor (Df), vitrification temperature (TG), leakage-proof electric trace index (CTI), thermal decomposition temperature (TD) and z-axis thermal expansion coefficient (CTE).
(I) PCB manufacturing process is complex and long, and process management and cost control are crucial
PCB production process is complex and long, process management ability is very important.
PCB manufacturer cost control can be realized through automatic transformation and process equipment adjustment and optimization, and excellent enterprises can copy and promote successful experience.
PCB industry cost control and process management are more representative of the company shenghong technology, jingwang electronics, etc., intelligent factory to enhance the per capita output value.
Equipment adjustment ability and order fullness often affect the operating efficiency of PCB enterprises, thus affecting profitability.
Excellent companies to absorb management experience and promote the line also has a successful case.
(ii) PCB has a wide range of application fields and a large number of plate types for subdivided fields
PCB prototype was born in the 1930 s, made of digital printing for insulation board base material, divided into a certain size, it comes with a conductive graphics and multiple hole location (component hole, fastening hole, hole metallization, etc.), is used to replace previous device electronic components of the chassis, and realize the connection between the electronic components, have the effect of relay transmission.
In recent years, PCB material, layer number and process have changed structurally. With the diversified development of downstream application scenarios and the application requirements of high-precision and small-scale modularization, the subdivided sections of PCB increase.
The softness of the base material can be divided into three categories: rigid board, flexible board and rigid-flexible composite board:
The application field can be subdivided into communication board, consumer electronics board, computer board, automotive electronics board, aerospace board, industrial control medical board.
Communication PCB and industrial control medical PCB are located in the golden track, and the growth rate of subdivided fields is in the front. Prismark estimates that global PCB output will grow at a compound rate of about 2.95 percent from 2018 to 2022. “5G will start large-scale construction in 2019, and will drive the growth of PCB demand. Prismark estimated that the compound growth rate of the demand for communication board will reach 3.5% from 2018 to 2022, and that for medical treatment, semiconductor and industrial control will be 3.0%/2.6%/2.5% respectively from 2018 to 2022. The construction of 5G is progressing smoothly. According to our estimation, the number of new 5G base stations will reach the peak around 2022. The amount of PCB in 5G base station is much higher than that in 4G base station, and the demand for high frequency and high speed PCB is increasing. The development opportunity of both quantity and price of communication PCB will rise in 5G era.