After the production of FPC flexible circuit board products, circuit board factories often need to use the correct method for quality testing, so as to ensure the quality of circuit board, so how do we test correctly? Caber technology production of every FPC circuit board products have to go through strict quality inspection, today caber xiaobian summary of FPC soft board quality inspection notice?
1. Adhesion of copper foil refers to the adhesion force of printed wires and pads on the substrate. The adhesion force is small, and printed wires and pads are easy to be separated from the substrate. Circuit board factory can use tape to check the adhesion of copper foil, stick the transparent tape to the wire to be tested, remove the bubbles, and then quickly tear off the tape with force in the direction of 90° with the printed circuit board. If the wire is intact, the copper foil adhesion of the printed circuit board is qualified.
2. The circuit board factory quality inspection content including surface finish, whether the printing is clear and bonding pad roundness and whether welding hollow in the center of the pad, photographic reproduction method is used to make the film covering the already processed on the printed circuit board, the determination of the edge of the printed circuit board size, width and shape of the wire is in the range of requirements.
3. The weldability of solder pads is an important index of printed circuit board. It mainly measures the wetting ability of solder pads, which can be divided into three indexes: wetting, semi-wetting and non-wetting.
4. The electrical performance test mainly includes the insulation and connectivity of FPC soft board. The connectivity can be measured by optical board tester. Insulation inspection mainly measures insulation resistance, circuit board factory can choose two or more closely spaced wires, first measure insulation resistance, then humidify heating for a certain time and restore to room temperature and then measure again.