Blind buried hole circuit boards are prone to reflow in the production process, causing plate bending and warping, affecting the product qualification rate. Then, how to reduce the risk of bending and deformation in the production of blind buried hole circuit boards?
1. Reduce the influence of temperature on the stress of blind buried hole circuit board. As temperature is the main source of circuit board stress, as long as the temperature of the reflow furnace or slow down the production heating speed of the circuit board in the welding furnace, the bending and warping of the plate can be greatly reduced.
2. Using high Tg board can increase its ability to bear stress and deformation, but the production cost of circuit board is also relatively high.
3. Increase the thickness of blind hole circuit board. In order to achieve lighter weight, the thickness of circuit board of many electronic products is 1.0mm, 0.8mm, or 0.6mm. It is suggested that if there is no requirement, the circuit board should preferably be 1.6mm thick, which can greatly reduce the risk of plate bending and deformation.