Glass core substrates are being evaluated as an alternative to traditional organic PCB substrates for high-performance computing applications. According to recent industry technical research, glass-based substrates deliver better warpage control and improved signal integrity at speeds above 112 Gbps. While lab and prototype testing shows promising performance, mass production for server-grade applications is still targeted for 2026–2027. This material trend may reshape requirements for substrate manufacturing, lamination and precision dimensional control in advanced PCB and packaging substrate markets.
