1、 Single panel type:
① Wiring board
② Antenna board
③ Plug plate
④ Battery board
⑤ Light strip
⑥ Touch screen board (silver paste)
Features and uses:
① Wiring board: it is used to connect the side of the machine and when the line is not long enough. The reverse folding board is easy to break (bending the wiring board). The fingers are bent and pasted on the back;
② Antenna board: the insulation printed on the front (green oil) is the same as the covering film, and 3M adhesive tape (3m467) on the back is mainly used for mobile phone contact signal;
③ Plug board: USB interface, directly inserted into the conductive, the back of the plug must be pasted with PI polyimide;
④ Battery board: the front must be pasted with hardware (the hardware has positive and negative “+” – “t” and grounding) for conducting electricity during charging;
⑤ Light strip: very long, all pads are the same;
⑥ Touch screen board: thick fingers shall be connected with silver paste;
2、 Type of double-sided board:
① Camera (BGA, steel plate)
② Module board (LCM)
③ Backlight board
④ Light strip
⑤ Key board
⑥ Touch screen panel
⑦ Battery board
⑧ Special board, hollow board
Features and uses:
① Camera (dual BGA board): BGA has small solder joint and steel sheet is pasted on the back, which is used for mobile phone camera (minimum 0.12-0.18, side 0.15-0.05);
② Module board: many thin fingers (more than 100) are used at the mobile phone display screen, and the pressed glass is conductive;
③ Backlight board: the front screen printing white oil (blocking light) is used as spider pad, and there is no reinforcement (PI) (PI in specific cases). The plate spacing is between 0.7-0.8;
④ Light strip: the plate is very long, there is no reinforcement, and the forming is troublesome (one meter);
⑤ Key board: it is divided into main key and side key, and pot pieces (also known as shrapnel) are pasted on the front of the window;
⑥ Touch screen board: there are thick fingers on the front and silver paste (conductive)
⑦ Battery board: hardware is pasted on the front for charging;
⑧ Special board and hollowed out board: made of pure copper, also divided into single side and double side. Hollowed out is between thick fingers. The number one drilling machine is used between copper and copper.
3、 Types of multilayer boards:
Double layered board, three layered board, four layered board
Features and functions:
Multilayer boards: they are all composed of single panels. First make the middle layer, and then the outer layer. The inside is pasted with adhesive tape, and then cut off the adhesive tape after forming;
The function of layered board makes the board softer;
Soft hard combination board: the soft board and the hard board are combined for conduction
4、 Plate classification:
① Substrate
② Covering film
③ Reinforcement
④ Glue
⑤ Electromagnetic film
⑥ Ink
1. The base material is divided into single-sided base material, double-sided base material and pure copper
A. Single side base material structure (glued material): copper (Cu), glue (AD), PI (polyimide, fire prevention) features: high temperature resistance, fire prevention, moisture resistance, storage at minus 50 °
B. Double sided substrate structure: copper (Cu), adhesive (AD), PI (polyimide), adhesive (AD), copper (Cu)
A classification of copper: calendered copper (RA) and electrolytic copper (ED)
① Calendered copper (RA), black (line color), good flexibility, expensive, calendered direction, used for flip and slide mobile phones; Module board, good bending and unsightly;
② Electrolytic copper (ED), yellow (line color), poor flexibility, cheap price, beautiful, no direction to extend, and poor bending;
For all press ground copper (RA), one side of the base material in the direction (infinite length) is fixed with a size of 250mm, and the other side is infinite;
Classification of rolling direction of rolled copper (RA): forward rolling and reverse rolling;
The line made along the extension direction is relatively straight and infinitely long
The line made against the extension direction is a little bent, with a side of 250mm
Extension: it means that the circuit board is spliced along the direction of infinite length, which has the advantage of long bending life; It is characterized by a waste of plate length (some companies require the splicing to be carried out along the calendering direction, while some companies require the saving of plates and do not require the calendering direction).
Reverse extension: it refers to the splicing of the circuit board in the direction of 250 mm.
Splicing size: one side of the plate is fixed for 250mm, and the minimum splicing size shall not be less than (250 * 60), which is less than 60mm. It is easy to draw the plate into the machine during pressing. Under special circumstances, the plate can be connected and pressed with FR4 plate.
5、 Thickness of base material: unit: Um (micron) 1um = 0.001 mm
Copper / PI 12 / 12.5 18 / 12.5 18 / 25 35 / 25
1/3 OZ 1/2 OZ 1.0 OZ
Single panel structure:
Copper Cu 12 18 35
Ad glue 12 / 12.5 12.5/13 18 / 20 20 / 25
PI 12．5 12．5 25 25
12．5 um =0．0125㎜=1/2mil
25 um =0．025㎜=1mil
Thickness of double-sided substrate:
Copper / PI 12 / 12.5 18 / 12.5 18 / 25 35 / 25
Double panel structure:
CU 12 18 18 35
AD 12/12．5 12．5/13 18/20 20/35
PI 12．5 12．5 25 25
AD 12/12．5 12．5/13 18/20 20/35
CU 12 18 18 35
18 / 12.5 half to half material (H / h)
35 / 25 is one-to-one material (1 / 1)
When making boards with one-to-one materials, first determine whether to use “RA” or “Ed”
Thickness of copper: 1 / 3oz = 12um (module) 1 / 2 = 18um 1 / 1 = 35um
Thickness of PI (only these two thicknesses): 12.5 um = 0.0125 mm = 1 / 2mil
25 um =0．025㎜=1mil
6、 Substrate
Adhesive free substrate (expensive): single panel (Cu + PI) double-sided board (Cu + PI + Cu)
Adhesive base material (cheap): single panel (Cu + AD + PI) double-sided board (Cu + AD + PI + AD + Cu)
Features of adhesive base material: poor peel strength, soft and thin thickness of pad;
Features of non adhesive base material: good peeling degree of pad, thicker and falling pad.
7、 CoV: also known as encapsulation or protective film.
Function: insulation and protection of lines
Features: resistance welding, anti-oxidation, high temperature resistance (250mm)
Structure: PI (film surface) yellow surface + ad (glue surface) white surface
Thickness: PI + ad
12．5 um 25 um
12/12．5/13/15 20/25/30
8、 Reinforcement: Pi, FR4, steel sheet and pet (including glue)
The thinner the PI, the lighter the color. On the contrary, the darker the color
PI thickness: 3mil, 4mil, 5MIL, 6, 7, 8, 9, 10 mil
0.075mm, 0.1, 0.125, 0.157… (increased by 0.025)
Generally speaking, the thickness of PI refers to the thickness of glue. The thickness of covering film only refers to the thickness of film “cov”, and the thickness of glue should be added in the calculation.
① PI is generally used to insert and pull the back of the finger, which is firmly pasted after high temperature pressing. Generally, it is pasted to insert and pull the finger, and the thickest one is 0.25 mm (± 0.025 mm);
② FR4 is a fiber material, which is mainly used for BGA board. FR4 is pasted on the back of two rows of thin fingers, mainly yellow and white, with a minimum thickness of 0.1mm and a maximum thickness of 3.2mm（ Back adhesive (usually 0.1mm, 0.15mm, 0.2mm and 0.25mm)
③ Sus is mainly used for key plate and BGA plate, with common thickness of 0.1mm, (commonly 0.15mm, 0.2mm) and 0.25mm;
④ Pet is divided into colored and transparent colors, with thicknesses of 0.1mm, 0.15mm, 0.175mm, 0.188mm, 0.2mm, 0.225mm and 0.25mm (including adhesive), of which the adhesive is pressure-sensitive adhesive.
9、 Adhesive: it is divided into thermosetting adhesive (high temperature adhesive) and pressure-sensitive adhesive, also known as conductive adhesive.
① High temperature adhesive: ad adhesive, pure adhesive, adhesive, thermosetting adhesive;
Thickness: 10um, 12um, 12.5um, 15um, 20um, 25um. The thicker the glue, the greater the glue overflow.
② Pressure sensitive adhesive:
Model thickness temperature
3m467 50um is not resistant to high temperature
3M966 60um 200°～ 230°
3m9077 50um 260 ° ~ 280 ° (more expensive)
3m468 100um 260 ° ~ 280 ° (more expensive)
The reflow temperature is 265 ° ~ 285 °. 3m9077 is used for welding;
Use thick glue for multi-layer and thin glue for steel sheet.
10、 Electromagnetic film: Black (thickness 22um, 8um) and silver.
Function: anti-interference, anti radiation, shielding, and must be connected with the ground wire. Windows need to be opened.
11、 Fixture and tool: mould, test stand, film, drill belt, drawing
Film: the film is exposed to copper;
Line: sample, reverse medicine film; Raw products, orthographic film;
Characters: orthographic drug film;
Mold: it is divided into steel mold (precision mold ± 0.05, ordinary mold and simple mold) and knife mold (± 0.2)
12、 Ink: divided into photosensitive, thermosetting and UV (generally not used for soft board)
① Photosensitive ink: make hard board double-sided, antenna board and plug board, and expose it with exposure machine for 10 ~ 15 minutes, 70 ° ~ 80 °, with green, purple and yellow;
② Thermosetting: baking at a temperature of more than 150 °, high temperature resistance, soft board characters in black and white.