Global flexible printed circuit (FPC) demand keeps rising, driven by foldable consumer electronics, wearable devices and automotive electronic modules. FPC features thin profile, bendability and high-density routing, which help reduce product weight and save internal space. Industry forecasts expect steady expansion through 2029. The growth brings new technical challenges, including fatigue resistance under repeated bending, dimensional stability and cover-layer bonding reliability, pushing the whole industry to improve material selection and reliability testing standards.
