The birth of a new patent for 3D printing of circuit board accelerates the pursuit of traditional PCB manufacturing
In March 2016, nano dimension, a well-known enterprise in the field of 3D printing electronics, announced that nano dimension technologies, a wholly-owned subsidiary of the company, had submitted a patent technology application to the U.S. patent and Trademark Office. The technology involved in the patent application is the method of printing screen wires on a PCB.
As we all know, the communication industry needs high-speed data transmission. The transmission speed on the current high-speed circuit can reach 60g-100g. PCBs in this industry often suffer losses due to the crosstalk of conductive lines and the phenomenon caused by the diversity of signals. Moreover, this loss phenomenon will interfere with the normal function of the circuit.
To solve this problem, nano dimension has developed a unique 3D printing method, which can create a 3D printing protective layer to shield the conductor, just like an insulated cable, and the new 3D printing process can plant it on the printed circuit board.
The patent application puts forward a solution to the power loss of printed circuit board, which is mainly used in the communication industry. This innovative approach creates an opportunity to minimize the size of printed circuit boards used in the field of high-speed communication.
By selectively depositing nano-sized conductive inks, manufacturers can generate a shield along the entire length of the wire at a minimum distance, so as to prevent leakage and loss. This is somewhat similar to using shielded cables outside printed circuits. But 3D printing technology enables the embedding of shielded cables (printed circuit boards).
High speed circuit board is not only an essential link in the telecommunications industry, but also an important part of the fast server that can realize real-time big data.
Circuit board 3D printing technology is available to accelerate the development of PCB technology.
