Copper clad ceramic substrate is made of metallized copper on the ceramic substrate to achieve better electrical performance and thermal conductivity. It is also used as insulating thermal conductive plate in many fields. Today, Xiaobian will share some characteristics, processes, processes and applications of copper clad ceramic substrate.
1、 Characteristics, advantages and disadvantages of copper-clad ceramic substrate
1. Aluminum nitride ceramic plate copper clad thickness and copper clad ceramic substrate double-sided copper clad thickness
Whether aluminum nitride ceramic plate coated with copper or alumina ceramic plate coated with copper is nothing more than making metallized copper on one or both sides of the ceramic substrate. The thickness is usually 35 microns, generally less than 500 microns. It is necessary to evaluate whether it is necessary to make more thick metal copper, The thickness of copper clad aluminum nitride ceramic plate and the thickness of double-sided copper clad ceramic substrate should be determined according to the demand and cost of the product.
2. Air tightness of ceramic copper clad substrate
Ceramic copper-clad substrate can achieve better conductivity and thermal conductivity after metallized copper thickness, because ceramic has good insulation, copper has outstanding conductivity and good air tightness. The air tightness of ceramic copper-clad substrate can be known by professional mass spectrometer leak detector.
3. Dimensions of copper-clad ceramic substrate
The size of copper-clad ceramic substrate. The size of copper-clad ceramic substrate is mainly customized according to the manufacturing requirements of customers. Conventional copper-clad ceramic substrates mainly include alumina copper-clad ceramic substrate and aluminum nitride ceramic copper-clad plate. Only the size of customers does not exceed the maximum size of conventional alumina ceramic substrate 120mm * 120mm and aluminum nitride ceramic substrate 110mm * 140mm. Special 200mm * 200mm needs special customization.
4. Specification of copper-clad ceramic substrate
The specifications of copper-clad ceramic substrate are divided into alumina copper-clad ceramic substrate and aluminum nitride copper-clad ceramic substrate. If the specifications are specified, the maximum size of alumina is no more than 120mm * 120mm, the maximum size of aluminum nitride is no more than 110mm * 140mm, and the substrate thickness is 0.15mm ~ 3.0mm. The copper thickness is generally 35 microns by default, which can be 500 microns. The specific workmanship requirements still need to be comprehensively evaluated.
5. Thickness of copper-clad ceramic substrate
The thickness of copper-clad ceramic substrate is the thickness of plate plus the thickness of metallization layer. For example, if the plate thickness is 0.25mm and the copper thickness is 35 microns, the plate thickness is the thickness converted and added by the two.
6. Advantages and disadvantages of copper-clad ceramic substrate
The advantages and disadvantages of copper-clad ceramic substrate are mainly reflected in the ceramic substrate. It is believed that using ceramic substrate as substrate has good thermal conductivity and insulation performance. Through copper-clad ceramic substrate, the electrical performance is also very good. Copper clad ceramic substrate, like ceramic substrate, not only has good thermal conductivity, but also has the characteristics that ceramics are easy to break. Especially thin ones, such as 0.15mm thick alumina ceramic substrate, are relatively easier to break.
2、 Production technology of copper clad ceramic substrate
1. AMB process of copper clad ceramic substrate
AMB (active metal bonding, AMB |), short for active metal brazing and copper coating technology, as the name suggests, relies on active metal solder to realize the high-temperature metallurgical combination of aluminum nitride and oxygen free copper. It has attracted much attention for its advantages of high bonding strength and good reliability of cold and hot cycle, and has a very broad application prospect. However, it should also be noted that the reliability of AMB process largely depends on many key factors such as active solder composition, brazing process and brazing layer structure. The process is difficult, and consideration should be given to cost.
5、 What are the manufacturers of DBC ceramic substrates
What are the problems of DBC ceramic substrate manufacturers? DBC ceramic substrate processing generally has large output and large batch, which requires high requirements for production capacity. Each ceramic substrate processing manufacturer, especially its main manufacturing process, production capacity and process capacity are also different.