Chemical equation of printed circuit board
2FeCl3 + Cu = 2FeCl2 + CuCl2, using the oxidizing copper oxide element of ferric ions, because the surface of the printed circuit board is copper-plated
2FeCl3 + Cu = 2FeCl2 + CuCl2, using the oxidizing copper oxide element of ferric ions, because the surface of the printed circuit board is copper-plated
I. Detection before power on When a circuit board is soldered, it is usually not to directly supply power to the circuit board when checking whether the circuit board can work normally, but instead to follow the steps below to ensure that there is no problem at each step and then power on is not [...]
The inspection after PCBA cleaning is mostly performed by visual inspection. For high-reliability products, special inspection equipment and standard methods are required to measure cleanliness. The standards for measuring cleanliness mainly include ion pollution and surface insulation resistance. First, cleanliness standards (1) Ionic pollution At present, there is no clear standard for ionic contamination in [...]
Prevent the deformation of the film inside the fence. 4. Design the alignment accuracy marks on the four corners of the board. 29. Why should the board be pre-baked before registration exposure? And is it baked at low temperature (75 ± 5 ℃)? Answer: Pre-baking of the board before the registration exposure: it is to [...]
Electromagnetic oven circuit board simple maintenance method The king said, che 2019-12-02 20:56 Macao video game city waiting for you! Play and entertain Macao video game city waiting for you! Play and entertain I this mad cut god destroy demon, dozen strange can upgrade VIP I this mad cut god destroy demon, dozen strange can [...]
PCB planning mainly includes the following parts: setting the shape and physical boundary of the circuit board, setting the electrical boundary of the PCB board, and setting the installation mode of the circuit board. They are described below. 1. Set PCB shape and physical boundary In the Protel DXP PCB board file wizard, we have [...]
There are fundamental differences between components and devices, such as resistors, capacitors and inductors, which do not change the internal molecular structure in production, that is, the performance only depends on the material. Devices generally refer to semiconductors, such as diodes, transistors, etc., whose molecular structure is altered during production. For example, in the production [...]
1. Gold sinking for FPC FPC Advantages: not easy to oxidize, can be stored for a long time, the surface is smooth, suitable for welding fine gap pins and components with small solder joints, can be repeated many times over reflow welding will not reduce its weldability. Disadvantages: high cost, poor welding strength, because the [...]
Circuit board wastewater Circuit board production enterprises in the circuit board grinding, etching, electroplating, hole metallization, development, stripping process will produce circuit board wastewater. Circuit board wastewater mainly includes the following: Complexing and chelating copper-containing wastewater produced by chemical copper deposition and etching processes, with a pH value of 9~10 and a concentration of Cu2+ [...]
Trivalent iron ions react with copper in REDOX reaction to form divalent iron ions and copper ions 2FeCl3+Cu=2FeCl2+CuCl2