The global printed circuit board industry is undergoing structural changes fueled by massive investment in AI high-performance computing. AI server hardware requires multi-layer PCBs, some reaching 20–46 layers, together with low-loss dielectric materials to satisfy high-speed signal transmission. Industry analysis indicates the AI-related PCB segment will maintain a much higher growth rate than conventional rigid boards. Tightened consumption of premium laminates and copper foil has extended lead times for advanced PCB products, while design specifications for impedance, signal integrity and thermal management become stricter across the whole sector.
