LTCC low-temperature CO firing technology is generally used to make multilayer ceramic circuit boards, and multilayer ceramic circuit boards and low-temperature CO firing technology are required in some specific fields. Today, let’s talk about the advantages and applications of LTCC low-temperature CO firing ceramic circuit boards.
1. What is LTCC ceramic circuit board
LTCC ceramic circuit board adopts LTCC low-temperature CO firing technology to sinter low-temperature sintered ceramic powder and metal slurry at 950 ℃, so as to make high-density circuit without mutual interference in three-dimensional space, and can also be made into three-dimensional circuit substrate with built-in passive components. The ceramic circuit board produced by this process is also called LTCC ceramic circuit board.
2. Advantages of LTCC ceramic circuit board
L What are the advantages of passive components and modules prepared by LTCC ceramic circuit board?
L it can meet the requirements of high current and high temperature resistance, and has better thermal conductivity than ordinary PCB circuit substrate;
L using metal materials with high conductivity as conductor materials is conducive to improving the quality factor of the circuit system;
L good temperature characteristics, such as small thermal expansion coefficient and small dielectric constant temperature coefficient, can make circuit substrates with very high layers and linewidth less than 50 μ M thin line structure.
L the passive components can be embedded in the multilayer circuit substrate, which is conducive to improving the assembly density of the circuit;
L the discontinuous production process allows the inspection of the green substrate, so as to improve the yield and reduce the production cost.
3. Application field of LTCC ceramic circuit board
LTCC ceramic circuit board developed earlier abroad and is applied in the fields of electrical components, communication and high-frequency microwave. LTCC
Ceramic circuit boards are used in LTCC components, LTCC functional devices, LTCC module substrates and LTCC integrated modules.