[summary of technical implementation steps] the technology relates to circuit board, which is a high-density interconnection circuit board of any layer. With the rapid development of electronic technology, the electronic products are also developing towards miniaturization, portability and high integration. Semiconductor component packaging also develops rapidly to multi pin fine spacing. Therefore, the PCB board with semiconductor components should also be small and lightweight and high-density. In recent years, in order to conform to the development direction of electronic complete machine products “light, thin, short and small”, HDI industry has also been developed rapidly, becoming the fastest developing part of PCB industry. Especially, the printed circuit HDI board is gradually developing from the first-order to the second and the multi-level. As the highest level of high-order interconnection technology, any layer of HDI products will be widely used in the industry. Any layer of high density interconnection circuit board: industry is commonly known as any layer HDI, which uses laser drilling to connect the layer with the layer before the layer. The copper foil substrate can be omitted from the middle substrate, which can make the thickness of the product change light and thin, and can meet the new requirements of miniaturization, lightweight and thinness of HDI products. However, how to realize the thin thickness of the dielectric layer and the small deviation; When blind holes are punched, the alignment target is also hit at the edge of the board. How to solve the technical problem of alignment offset by the line targeting is still to be improved. In view of this, in order to solve the above problems, the technology provides a high density interconnection board of any layer. The utility model relates to an arbitrary layer high-density interconnection circuit board, which includes at least two layers of inner layer core plates. The inner layer board core is provided with several embedded holes and core grooves. The inner wall of the embedded hole is coated with copper, and the embedded hole is filled with polypropylene glue. The surface of the inner core plate is provided with an outer core plate corresponding to it. The inner core plate and the outer core plate are provided with heat sink and explosion-proof groove, The outer core plate is staggered with blind holes, and the inner core plate and the outer core plate are provided with copper foil. The copper foil is coated with a bonding layer, and the copper foil is provided with an oxidation layer between the copper foil and the bonding layer, and the bonding layer is provided with an insulating layer, and the insulating layer is provided with at least one through hole, and the through hole is filled with nano silver conducting column. Further, the blind hole is[technical protection point] a high-density interconnection circuit board of any layer, including at least two layers of inner layer core board, which is characterized in that the inner layer board core is provided with several embedded holes, the inner wall of the embedded hole is coated with copper, the embedded hole is filled with polypropylene glue, and the surface of the inner core plate is provided with an outer plate corresponding to it, The inner core plate and the outer plate are provided with heat sink and explosion-proof groove through the outer plate, and the outer plate is staggered with blind holes. The inner core plate and the outer plate are provided with copper foil. The copper foil is coated with a bonding layer, and the copper foil is provided with an oxygen layer between the copper foil and the bonding layer, and the bonding layer is provided with an insulating layer, and the insulating layer is provided with at least one through hole, The through hole is filled with a nano silver conducting column.[Abstract of technical features] 1. a high-density interconnection circuit board of any layer, including at least two layers of inner layer core board, which is characterized in that the inner layer board core is provided with several embedded holes, the inner wall of the embedded hole is coated with copper, the embedded hole is filled with polypropylene glue, and the surface of the inner core plate is provided with an outer plate corresponding to it, The inner core plate and the outer plate are provided with heat sink and explosion-proof groove through the outer plate, and the outer plate is staggered with blind holes. The inner core plate and the outer plate are provided with copper foil. The copper foil is coated with a bonding layer, and the copper foil is provided with an oxygen layer between the copper foil and the bonding layer, and the bonding layer is provided with an insulating layer, and the insulating layer is provided with at least one through hole, The through hole is filled with a nano silver conducting column. 2. the high density interconnection circuit board of any layer as claimed in claim 1, which is characterized in that the blind hole is any shape in the cone, ellipse and inverted triangle. 3. the high density interconnection circuit board of any layer as claimed in claim 1, which is characterized in that the blind hole is surrounded by a metal layer of ring hole and the ring hole metal[patent technical properties] technical R & D personnel: yangmeiru, qiaopengcheng, hulihai, zhaohongjing, chenzhiyu, applicant (patent right): Tongjian Huiyang Electronic Co., Ltd., type: new country, province and province: Guangdong; forty-four
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