BOE A obtained the invention patent authorization for “A printed circuit board and its preparation method, display device” on October 14, 2025 (patent number CN202110201857.X). This technology reduces glue overflow, reduces the size of circuit boards, and improves the integration of display devices through the design of diversion grooves, without involving specific cooperative enterprises.
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News type, core content, release time, key impact
Policy dynamics strictly control new PCB projects, promote industry standardization, optimize production capacity structure by November 2025, and promote industry upgrading
Technological breakthrough in BOE circuit board preparation patent, reducing glue overflow, improving display device integration and reliability by October 2025
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