April 9, 2026 — A significant technological milestone has been reached in the development of high-layer count printed circuit board backplanes, with successful research and validation of 70-layer+ midplane and orthogonal backplane PCBs for next-generation AI supercomputers.
Independent technical testing institutions confirmed that the newly developed PCB backplanes achieve an exceptional layer-to-layer alignment precision of ±5μm, enabling unparalleled signal density and transmission speed for ultra-high-end computing systems. The technology has entered the pre-mass production phase, set to address the growing demand for advanced hardware support in global supercomputing and large-scale AI model training initiatives.