High frequency and high-speed technology: With the widespread adoption of 5G communication technology and the advancement of 6G technology, higher requirements have been put forward for the high-frequency and high-speed performance of circuit boards.
High density interconnect (HDI) technology: HDI boards have the characteristics of high line density, small aperture, and small wiring space, which can achieve the thinning and miniaturization of electronic products. At the same time, the integration of HDI technology with other advanced technologies such as embedded passive device technology and 3D packaging technology has brought new opportunities for the development of circuit boards.
Green manufacturing technology: The increasing awareness of environmental protection and the increasingly strict environmental regulations have prompted the PCB industry to develop towards green manufacturing. Green manufacturing technologies include lead-free processes, zero wastewater discharge technologies, and the application of environmentally friendly materials. For example, using lead-free solder instead of traditional lead containing solder reduces environmental pollution; By adopting advanced wastewater treatment technology, the recycling and zero discharge of wastewater have been achieved.