April 11, 2026 — The global high-performance computing (HPC) industry has officially designated M9-grade high-speed materials as the universal industry standard for next-generation AI server printed circuit boards in 2026, marking a pivotal technological transition in the PCB materials sector.
Independent material performance testing has verified that M9-grade laminates deliver ultra-low signal loss with a dissipation factor (Df) of ≤0.0008 at 10GHz, a critical specification for supporting the high-speed data transmission requirements of advanced AI computing architectures. This standardization is driving a comprehensive upgrade of the global high-frequency PCB material supply chain, with manufacturers worldwide aligning production processes to meet the new performance benchmarks.