With the mass deployment of several giant low orbit satellite Internet projects around the world, the on-board electronic equipment has strict requirements for high-frequency, lightweight and irradiation resistant PCBs. The L/Ka band communication module commonly uses special substrates with extremely low dielectric loss (such as PTFE composite materials), and is combined with precision laser drilling technology to achieve micro via holes and impedance control. This type of PCB needs to maintain dimensional stability under extreme temperature differences while meeting mechanical strength under emission vibration environments, and has become an important testing ground for high-end PCB technology.
