In advanced packaging and HDI board manufacturing, micro hole processing with blind hole diameter ≤ 75 μ m has become a bottleneck. The new laser drilling method completes the formation by high-precision copper breaking in a single pass, abandoning the traditional multi-step hole repair process, and combining with an automatic optical inspection system (AOI) to achieve standardized defect identification and large-scale quality control. This progress has raised the upper limit of PCB circuit density and helped to miniaturize equipment.
